HENGMU Group successfully exhibited at Labelexpo Asia 2025 in Shanghai, China, presenting its comprehensive portfolio of Release Material solutions to the Asian market. With a strategic focus on the self-adhesive label industry, this independent participation allowed HENGMU to demonstrate its technical capabilities, deepen engagement with regional partners, and showcase its versatility in release liner applications.
We are pleased to announce that we will be exhibiting at Labelexpo Europe 2025 in Barcelona, Spain. Join us from 16–19 September at Hall 3, Booth 3A88 to discover our latest innovations in release liners and adhesive solutions.